Chemical liquid processing apparatus for processing a substrate and the method thereof

ABSTRACT

In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] The subject application is related to subject matter disclosed inthe Japanese Patent Applications No.Tokugan2000-039683 filed in Feb. 17,2000, and No.Tokugan2000-297441 filed in Sep. 28, 2000 in Japan, towhich the subject application claims priority under the Paris Conventionand which is incorporated by reference herein.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a chemical liquid processingapparatus for processing a substrate using chemical liquid and achemical liquid processing method therewith and more particularly totechnology for processing various types of substrates such as asemiconductor substrate in semiconductor device manufacturing process,reticule (photo mask) in lithographic process which is one step ofsemiconductor device manufacturing process, and flat panel in liquidcrystal display manufacturing process.

[0004] 2. Description of the Related Art

[0005] Generally, chemical liquid processing for processing varioustypes of substrates using chemical liquid is carried out by performingchemical liquid film forming step for forming chemical liquid bypuddling on a processing object substrate, on which a processing objectfilm is formed, so as to process the processing object film into adesired configuration, and liquid removing (cleaning/drying) step forcleaning and drying the processing object substrate on which thechemical liquid is applied, repeatedly. Meanwhile, the chemical liquidprocessing step mentioned here includes, for example, developmentprocessing in photo-lithographic step of semiconductor manufacturingprocess, wet etching processing to be carried out afterphoto-lithographic step and the like.

[0006] By the way, the aforementioned chemical liquid film forming stepand liquid removing (cleaning/drying) step have following technicalproblems which should be solved.

[0007] First, technical problems in the chemical liquid film formingstep will be described.

[0008] The chemical liquid film forming step for etching the processingobject film by coating and settling the chemical liquid on theprocessing object substrate, on which the processing, object film isformed, has such a problem that supply of hew etchant to an etchingregion is not accelerated because etching product remains on the etchingregion and the surrounding of the etching region. As a result of thisproblem, etching velocity around the etching region is reduced. Thisproblem is particularly conspicuous around the etching region near abroader etching region.

[0009] To solve this problem, some applications were proposed up to now.For example, Japanese Patent Application Laid-Open No. H11-329960 hasdisclosed a technology of moving chemical liquid on the processingobject film at the time of etching. According to this document, apredetermined sheet material is brought into contact with the surface ofchemical liquid on the processing object film and by moving that sheetmaterial, the chemical liquid is moved on the processing object film. Bymoving the chemical liquid on the processing object film, a flow isgenerated in the chemical liquid so that the chemical liquid isagitated. As a result, new etchant is supplied to the etching region,thereby making it possible to suppress reduction of the etching velocityin the etching region near a broader etching region.

[0010] However, if such technology is employed, after the chemicalliquid is agitated, the sheet material needs to be washed and whenwashing the sheet material, dust and dirt adhering to the sheet materialadhere to the surface of the processing object substrate, so that adefect may occur on the processing object substrate.

[0011] On the other hand, according to other proposal, the chemicalliquid is moved on the processing object film by rotating the processingobject substrate intermittently (see Japanese Patent ApplicationLaid-Open No. H11-307433). According to this technology, the processingobject substrate is held by the substrate holding portion and byrepeating a rotation and a static condition of the processing objectsubstrate, the chemical liquid is moved.

[0012] However, as a result of investigation of this technology byinventors of the present invention, when the processing object substratewas rotated, the chemical liquid was not moved but rotated together withthe processing object substrate because of its viscosity. And, when therotation of the processing object substrate was stopped, the chemicalliquid only trembles slightly due to its inertial force. Therefore, evenif this technology is employed, the reduction of etching velocity in theetching region near a broader etching region must be difficult tosuppress sufficiently.

[0013] As described above, the conventional chemical liquid film formingstep cannot suppress the reduction of etching velocity in the etchingregion without generation of defects or additional work. Thus, the yieldrate of the entire chemical liquid processing cannot be improved.

[0014] Next, technical problem of liquid removing (cleaning/drying) stepwill be described.

[0015] In a conventional liquid removing (cleaning/drying) step,cleaning chemical liquid on the substrate is blown out and removed byrotating the substrate at high speeds.

[0016] However, when the liquid removing (cleaning/drying) step iscarried out by this method, the quantity of defects induced bymicroscopic dust generated from abrasion between a chuck for fixing thesubstrate and a rear face of the substrate is increased with decrease ofpattern dimension and increase of rotation speed. Further, because ofincreases of aspect ratio of resist pattern and diameter of thesubstrate with micro-fabricated resist pattern in recent years,influences by water flow and centrifugal force generated at high speedrotation increase, so that pattern fall is more likely to occur. Thus,in the conventional liquid removing (cleaning/drying) step, the yieldrate of the entire chemical liquid processing cannot be improved likethe chemical liquid film forming step.

[0017] As described above, the conventional chemical liquid processingapparatus and chemical-liquid processing method have technical problemswhich should be solved early in both the chemical liquid film formingstep and liquid removing (cleaning/drying) step. Thus, it is difficultto improve the yield rate of the entire chemical liquid processing.

SUMMARY OF THE INVENTION

[0018] The present invention has been achieved to solve the abovedescribed technical problems and its object is to provide a chemicalliquid processing apparatus capable of improving the yield rate ofchemical liquid processing.

[0019] Another object of the present invention is to provide a chemicalliquid processing method capable of improving the yield rate of thechemical liquid processing.

[0020] According to a first feature of the chemical liquid processingapparatus and the chemical liquid processing method, there are includedat least the steps of: supplying chemical liquid for processing aprocessing object film to a processing object substrate, on which theprocessing object film is formed, so as to form chemical liquid film onthe processing object substrate; and after the step for forming thechemical liquid film, forming air flow such that it makes a contact withthe chemical liquid film so as to hold the chemical liquid film on theprocessing object substrate and form a flow of the chemical liquid onthe surface of the chemical liquid film.

[0021] According to this chemical liquid processing apparatus andchemical liquid processing method, the chemical liquid is moved byforming airflow above the chemical liquid film and making the air flowinto contact with the surface of the chemical liquid. By this procedure,the chemical liquid is agitated, thereby improving uniformity ofprocessing the processing object film by the chemical liquid. In thepresent invention, the steps of forming chemical liquid film on theprocessing object substrate and forming the flow of chemical liquid onthe chemical liquid film is defined as chemical liquid filmforming/agitating process.

[0022] Further, the second feature of the chemical liquid processingapparatus and chemical liquid processing method according to the presentinvention is that, a process for removing liquid supplied beforehand toa substrate comprising the steps of: holding said substrate; rotating aplate having an air intake hole on said substrate; generating a negativepressure between the plate and a processing object substrate by rotatingsaid plate; and generating air flow between said processing objectsubstrate and said plate by sucking air through said air intake hole inthe presence of the negative pressure.

[0023] According to this chemical liquid processing apparatus andchemical liquid processing method, the liquid on the substrate can beremoved without rotating the substrate. And further, the occurrence offall of resist pattern, which occur from the effect of a centrifugalforce and water flow generated in the case of removing liquid byrotating a substrate, can be reduced. Further more, by not-rotating thesubstrate, generation of dust from the rear face due to abrasion betweenthe substrate and the chuck could be prevented.

[0024] Further, according to a third feature of the chemical liquidprocessing apparatus and the chemical liquid processing method, thereare included the steps of: supplying chemical liquid for processing aprocessing object film to a processing object substrate on which saidprocessing object film is formed so as to form chemical liquid film onsaid processing object substrate; after the step for forming thechemical liquid film, forming air flow which contacts with the chemicalliquid film so as to hold said chemical liquid film on said processingobject substrate and form a flow of the chemical liquid on the surfaceof said chemical liquid film using a plate disposed above saidprocessing object substrate and having an air intake hole with the valveat the center; and removing said chemical liquid supplied to asubstrate, wherein the step for removing said chemical liquid suppliedto a substrate further comprises the steps of: generating a negativepressure between the plate and said processing object substrate byrotating said plate; and generating air flow between said processingobject substrate and said plate by sucking air through said air intakehole in the presence of the negative pressure.

[0025] According to this chemical liquid processing apparatus andchemical liquid processing method, by performing the successive processof agitating the chemical liquid film on the processing object substraterinsing the processing object substrate surface and removing thechemical liquid film using the plate, it is possible to (1) improve theuniformity of the processing the processing object substrate by chemicalliquid, (2) reduce the occurrence of fall of resist pattern, which occurfrom the effect of a centrifugal force and water flow generated in thecase of removing liquid by rotating a substrate, and (3) prevent thegeneration of dust from the rear face due to abrasion between thesubstrate and the chuck. As a result, the yield rate of the entirechemical liquid processing can be improved.

[0026] Other and further objects and features of the present inventionwill become obvious upon understanding of the illustrative embodimentsabout to be described in connection with the accompanying drawings orwill be indicated in the appended claims, and various advantages notreferred to herein will occur to one skilled in the art upon employingof the invention in practice.

BRIEF DESCRIPTION OF THE DRAWINGS

[0027]FIG. 1 is a flow chart showing a chemical liquid processing methodaccording to the embodiment of the present invention;

[0028]FIG. 2 is a schematic diagram for explaining a chemical liquidfilm forming step according to the embodiment of the present invention;

[0029]FIG. 3 is a schematic diagram for explaining a chemical liquidfilm forming step according to the embodiment of the present invention;

[0030]FIG. 4 is a schematic diagram for explaining a chemical liquidfilm forming step according to the embodiment of the present invention;

[0031]FIG. 5 is a schematic diagram showing a structure of a gas supplyportion according to the embodiment of the present invention;

[0032]FIG. 6 is a schematic diagram showing a structure of a gas supplyport of the gas supply portion according to the embodiment of thepresent invention;

[0033]FIG. 7 is a schematic diagram showing a structure of a chemicalspouting nozzle according to other embodiment of the present invention;

[0034]FIG. 8. is a schematic diagram showing a structure of a chemicalspouting nozzle according to other embodiment of the present invention;

[0035]FIG. 9 is a schematic diagram for explaining a chemical liquidfilm forming step according to the other embodiment of the presentinvention;

[0036]FIG. 10 is a schematic diagram for explaining a chemical liquidfilm forming step according to the other embodiment of the presentinvention;

[0037]FIG. 11 is a schematic diagram for explaining a chemical liquidfilm forming step according to the other embodiment of the presentinvention;

[0038]FIG. 12 is a schematic diagram, showing a structure of a plateaccording to the other embodiment of the present invention;

[0039]FIG. 13 is a schematic diagram showing a structure of a plateaccording to the other embodiment of the present invention;

[0040]FIG. 14 is a schematic diagram showing a structure of theapparatus which is used in liquid removing step according to theembodiment of the present invention;

[0041]FIG. 15 is a schematic diagram for explaining a liquid removingstep according to the embodiment of the present invention;

[0042]FIG. 16 is a schematic diagram showing a condition of a plate inthe initial phase of rotation;

[0043]FIG. 17 is a schematic diagram showing a condition of a platerotating normally;

[0044]FIG. 18 is a schematic diagram for explaining a condition of gasflow when drying;

[0045]FIG. 19 is a schematic diagram for explaining a fall of resistpattern according to a conventional drying method;

[0046]FIG. 20 is a diagram for explaining a force applied to liquidbetween the resist patterns according to the drying method of theembodiment of the present invention; and

[0047]FIG. 21 is a diagram for explaining a force applied to liquidbetween the resist patterns according to the drying method of otherembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0048] Various embodiments of the present invention will be describedwith reference to the accompanying drawings. It is to be noted that thesame or similar reference numerals are applied to the same or similarparts and elements throughout the drawings, and the description of thesame or similar parts and elements will be omitted or simplified.

[0049] The chemical liquid film forming/agitating process and liquidremoving (cleaning/drying) process according to the embodiment of thepresent invention is explained below with reference to FIG. 1˜FIG. 21.

[0050] ˜Chemical Liquid Film Forming/Agitating Process˜

[0051] First, the chemical liquid film forming/agitating processaccording to the embodiment of the present invention is described.

First Embodiment

[0052] First, chemical liquid processing method according to the firstembodiment of the present invention is explained with reference to FIG.1-4.

[0053] (1) First, as shown in FIG. 2A, the processing object substrate10 which preparing step is finished is carried to the top of thesubstrate holding portion 12 by means of a transportation robot (notshown). And, the processing object substrate 10 is left from thetransportation robot and received by the substrate holding portion 12.The processing object substrate 10 is fixed to the substrate holdingportion 12 by sucking (S101).

[0054] (2) Next, as shown in FIG. 2B, chemical liquid 16 for processinga processing object film on the processing object substrate 10 is formedon the processing object substrate 10. Chemical liquid 16 is suppliedfrom, for example, the chemical spouting nozzle 14 disposed above theprocessing object substrate 10. The chemical spouting nozzle 14 scansthe processing object substrate 10 from an end of the processing objectsubstrate 10 to the other end thereof while supplying the chemicalliquid 16. Consequently, the chemical liquid film 16 is formed on theprocessing object substrate 10 (S102).

[0055] (3) Next, as shown in FIG. 3A, gas is supplied from the gassupply portion 18 disposed near the outer periphery of the processingobject substrate 10 so as to form air flow above the chemical film 16formed on the processing object substrate 10. It is effective to rotatethe processing object substrate 10 when the air flow is formed byrotation of the substrate holding portion 12. In this case, it isdesirable for the rotation direction of the processing object substrate10 to coincide with the direction of the air flow (S103).

[0056] (4) Next, as shown in FIG. 3B, rinse liquid (e.g., pure water) 22is supplied from the rinse liquid supply port 20 disposed above theprocessing object substrate 10 and the processing object substrate 10 iscleaned while rotating it (S104).

[0057] (5) Finally, as shown in FIG. 4, rinse liquid 22 on theprocessing object substrate 10 is blown out by rotating the processingobject substrate at high speeds and the substrate 10 is dried (S105).

[0058] In the first embodiment of the present invention, the gas supplyportion 18 is desired to be disposed as follows. FIG. 5 shows thedisposition of the gas supply portion 18. FIG. 5A shows the examplewhich a gas supply portion 18 a is disposed near the outer-periphery ofthe processing object substrate 10. The directions of air flows coincidewith a substrate rotation direction. FIG. 5B shows the example which twogas supply portions 18 a, 18 b are disposed near the outer periphery ofthe processing object substrate 10 such that they oppose each other. Theboth directions of air flows in the gas supply portions 18 a, 18 bcoincide with a substrate rotation direction. FIG. 5C shows the examplewhich two gas supply portions 18 c, 18 d is disposed in parallel nearthe outer periphery of the processing object substrate 10. Here, the gassupply portion 18 c near the outer periphery (outer circle range) of theprocessing object substrate 10 ensures a faster gas flow than the gassupply portion 18 d near the center (inner circle range) of theprocessing object substrate 10. The directions of gas flows from the gassupply portion 18 c, 18 d coincide with the rotation direction of thesubstrate. FIG. 5D shows the example which two gas supply portions 18 c,18 d is disposed near the outer periphery of the processing objectsubstrate 10 while disposing gas supply portions 18 e, 18 f in parallelso as to oppose the gas supply portions 18 c, 18 d. Here, the gas supplyportions 18 c, 18 f near the outer periphery of the processing objectsubstrate 10 ensure a faster gas flow than the gas supply portions 18 d,18 e near the center of the processing object substrate 10. Thedirections of gas flows from the gas supply portions 18 c, 18 d, 18 e,18 f coincide with the rotation direction of the substrate.

[0059] The gas supply port of the gas supply portion 18 can havestructures as follows. FIG. 6 shows the cross section of the gas supplyport. FIG. 6A, 6B, 6C shows the flat port structure with a constant flowrate in both the inner circle and outer circle ranges, the flat portstructure ensures a low flow rate in the inner circle range whileensuring a higher flow rate in the outer circle range, and a structurewhich a port width is small in the inner circle range while it increasesas it goes to the outer periphery range can be considered, respectively.

[0060] In the above described embodiment, the supply of the chemicalliquid 16 is not restricted to by scanning the chemical spouting nozzle14 from one end to the other end and it is permissible to use the nozzleas follows. FIG. 7 shows a bar-like nozzle and FIG. 7A, 7B is a crosssection and a plane figure when supplying the chemical liquid,respectively. And, FIG. 8 shows a straight nozzle and FIG. 8A, 8B is across section and a plane figure when supplying the chemical liquid,respectively.

[0061] Next, the chemical liquid processing method according to thefirst embodiment of the present invention is explained with the resultof the experiment performed by the inventors.

[0062] First, reflection preventing film of 6 nm and resist film of 400nm were formed successively on a semiconductor substrate 10, which wasthe processing object substrate. Then, after a latent image was formedon a resist film using an exposure device, baking was carried out at130° for 60 seconds.

[0063] Next, developing solution 16, which was the chemical liquid, wassupplied to the top of a semiconductor substrate 10 so as to form thefilm of the developing solution 16 by puddling on the semiconductorsubstrate 10. Then, nitrogen gas was supplied to the top of thesemiconductor substrate 10 so as to form a flow of nitrogen gas suchthat it contacts the surface of the developing solution film 16. Theflow rate of the nitrogen gas was adjusted to 150 to 400 mm/sec on thesurface of the developing solution film 16 and at the same time, otheradjustment was made for the developing solution 16 not to flow out ofand to a rear face of the semiconductor substrate 10. Further, the gassupply portion 18 was disposed as shown in FIG. 5D and the flow rate ofnitrogen gas was set to be quicker on the outer circle range than theinner circle range. Further, when supplying nitrogen gas, thesemiconductor substrate 10 was rotated and the rotation direction wasmade to coincide with the direction of gas flow. At this time, therotation speed of the semiconductor substrate 10 was 5 rpm and thesurface rotation speed of the developing solution 16 was 35 rpm. Thatis, the surface rotation speed (relative rotation speed) of thedeveloping solution film 16 relative to the rotation speed of thesemiconductor substrate 10 was 30 rpm.

[0064] Here, I-beam resist film was formed on another semiconductorsubstrate and exposed irregularly. Then, the aforementioned relativerotation speed was reproduced and a flow of solution was observed. As aresult of observation, it was recognized that the solution moved on thesurface of the semiconductor substrate at 100 μm/sec. If thesemiconductor substrate was rotated intermittently at 25 rpm like incase of the prior art, the moving speed of the solution was 5 μm/sec, sothat it was recognized that little flow of the solution occurred on thesurface of the semiconductor substrate.

[0065] Subsequently, after developing for 60 seconds, a supply ofnitrogen gas was stopped and the rotation speed of the semiconductorsubstrate 10 was raised to 500 rpm. Then, pure water was poured from therinse liquid supply portion so as to rinse the surface of thesemiconductor substrate. After rinsing, the supply of pure water wasstopped and the semiconductor substrate was rotated at a high speed toblow pure water out of the surface of the semiconductor substrate 10 anddry the surface.

[0066] Finally, after stopping the rotation of the semiconductorsubstrate 10, the semiconductor substrate 19 was carried using atransportation robot and then chemical liquid processing was,finished.

[0067] The distribution (3 σ value) of resist pattern dimension in thesemiconductor substrate plane with this chemical liquid processing was4.5 nm with an isolation of 130 nm. As compared to 10 nm, which wasobserved when no air flow was formed, processing uniformity was improvedtremendously.

[0068] In the first embodiment of the present invention, the relativerotation speed of the film of the chemical liquid 16 is not restrictedto 30 rpm, but may vary in a range of 10 to 60 rpm. More preferably, itis 30 to 40 rpm. Unless the chemical liquid 16 is blown out of theprocessing object substrate 10, the relative, rotation speed may be morethan 60 rpm. Further, the processing object substrate 10 does not haveto be rotated continuously, but may be rotated by an intermittent turnof 90° every 10 and several seconds.

[0069] Further, gas supplied from the gas supply portion 18 is desiredto be inactive gas having a low chemical reactivity. For example, it ispermissible to use helium, argon or the like as well as nitrogen gas.

[0070] Although the first embodiment of the present invention is appliedto development process, it can be used in any method of processing(etching) which chemical liquid film is formed by puddling.

[0071] Although, in the above embodiment, the circular processing objectsubstrate is employed, for example, a mask substrate for exposure or arectangular substrate like a liquid crystal substrate can be employed.

Second Embodiment

[0072] Next, the chemical liquid processing according to the secondembodiment of the present invention is described.

[0073] Although air flow is formed above the film of the chemical liquid16 by supplying gas from the gas supply portion 18 disposed near theouter periphery of the processing object substrate 10 according to thefirst embodiment of the present invention, in the second embodiment ofthe present invention, air flow is formed by a rotation of a platedisposed above the film of the chemical liquid 16. Referring FIG. 1,FIG. 9˜FIG. 11, the chemical liquid processing method according to thesecond embodiment of the present invention is explained below.

[0074] (1) First, as shown in FIG. 9A, the processing object substrate10 which preparing step is finished is carried to the top of thesubstrate holding portion 12 by means of a transportation robot (notshown). Then, the processing object substrate 10 is left from thetransportation robot and received by the substrate holding portion 12.The processing object substrate 10 is fixed to the substrate holdingportion 12 by sucking (S101).

[0075] (2) Next, as shown in FIG. 9B, chemical liquid 16 for processinga processing object film on the processing object substrate 10 is formedon the processing object substrate 10. Chemical liquid is supplied from,for example, the chemical spouting nozzle 14 disposed above theprocessing object substrate 10. The chemical spouting nozzle 14 scansthe processing object substrate 10 from an end of the processing objectsubstrate 10 to the other end thereof while supplying the chemicalliquid 16. Consequently, the chemical liquid film 16 is formed on theprocessing object substrate 10 (S102).

[0076] (3) Next, as shown in FIG. 10A, air flow is formed above the filmof the chemical liquid 16 on the processing object substrate 10 byrotating a circular plate 28 disposed above the processing objectsubstrate 10. The circular plate 28 is a larger disc than the processingobject substrate 10 and disposed near the processing object substrate 10such that it is not in contact with the surface of the chemical liquidfilm 16. The central portion of the circular plate 28 is hollow and thissection can be opened or closed by a valve (not shown). It is effectiveto rotate the processing object substrate 10 when the air flow is formedby a rotation of the substrate holding portion 11. In this case, therotation direction of the processing object substrate 10 is desired tocoincide with the direction of air flow (S103).

[0077] (4) Next, as shown in FIG. 10B, rinse liquid (e.g., pure water)22 is supplied from the rinse liquid supply port 20 disposed above theprocessing object substrate 10 and the processing object substrate 10 iscleaned while rotating it (S104).

[0078] (5) Finally, as shown in FIG. 11, rinse liquid 22 on thesubstrate is blown out to dry by rotating the substrate at high speeds(S105).

[0079] Next, the chemical liquid processing method according to thesecond embodiment of the present invention is explained with the resultof the experiment performed by the inventors.

[0080] First, reflection preventing film of 6 nm and resist film of 400nm were formed successively on a semiconductor substrate 10, which wasthe processing object substrate. Then, after a latent image was formedon a resist film using an exposure device, baking was carried out at130° for 60 seconds.

[0081] Next, developing solution 16, which was the chemical liquid, wassupplied to the top of a semiconductor substrate 10 so as to form filmof the developing solution 16 by puddling on the semiconductorsubstrate. Then, the circular plate 28 is rotated near the processingobject substrate 10 such that it is not in contact with the surface ofthe chemical liquid film 16 (for example, about 15 mm). Then, therotation speed of the circular plate 28 was adjusted so that the surfacerotation speed of the chemical liquid film 16 on the processing objectsubstrate 10 is 40 rpm. Upon this adjustment, the valve of the rotatingbody 28 was opened. And, the semiconductor substrate 10 is rotated by 10rpm during the process. At this time, the rotation speed of the circularrotating body 25 was 4,000 rpm.

[0082] Subsequently, after developing for 60 seconds, a supply ofnitrogen gas was stopped and the rotation speed of the semiconductorsubstrate 10 was raised to 500 rpm. Then, pure water was poured from therinse liquid supply portion so as to rinse the surface of thesemiconductor substrate 10. After rinsing, the supply of pure water wasstopped and the semiconductor substrate 10 was rotated at a high speedto blow pure water out of the surface, of the semiconductor substrate 10and dry the surface.

[0083] Finally, after stopping the rotation of the semiconductorsubstrate, the semiconductor substrate 10 was carried using atransportation robot and then chemical liquid processing was finished.

[0084] The distribution (3 σ value,) of resist pattern dimension in thesemiconductor substrate plane with this chemical liquid processing was4.5 nm with an isolation of 130 nm. As compared to 10 nm, which wasobserved when no air flow was formed, processing uniformity was improvedtremendously.

[0085] In the second embodiment of the present invention, the circularplate 28 which form air flow over chemical liquid film 16 may be aring-like rotating plate 30 as shown in FIG. 12. And also, it can beblade-like rotating plate 32 as shown in FIG. 13.

[0086] In the above mentioned experiment, the relative rotation speed ofthe developing solution film 16 is not restricted to 40 rpm, but mayvary in a range of 10 to 60 rpm. And also, the distance between theplate 28 and the semiconductor surface 10 is not restricted to 15 mm.The distance between each plate 28,30,32 and the surface of chemicalliquid film 16, and the rotation speed of each plate 28,30,32 can be setto any condition, if the predetermined surface rotation speed ofdeveloping solution film 16 is obtained and developing solution 16 donot flow out of and to a rear face of the semiconductor substrate 10.More preferably, it is desirable that the distance between each plate28,30,32 and developing solution film 16 is in the range of 10˜30 mm andthe rotation speed of each plate 28,30,32 is around 2000˜6000 rpm.

Third Embodiment

[0087] Next, the chemical liquid processing according to the thirdembodiment of the present invention is explained.

[0088] Although gas supplied above the film of the chemical liquid 16 bythe gas supply portion 18 is restricted to only inactive gas such asnitrogen gas according to the first embodiment, in the third embodimentof the present invention, the other gas such as ozone is added. Thethird embodiment of the present invention is explained below referringthe result of the experiment which the inventors performed.

[0089] First, reflection preventing film of 6 nm and-resist film of 400nm were formed successively on a semiconductor substrate 10, which wasthe processing object substrate. Then, after a latent image was formedon a resist film using an exposure device, baking was carried out at130° for 60 seconds.

[0090] Next, developing solution 16, which was the chemical liquid, wassupplied to the top of a semiconductor substrate 10 so as to form filmof the developing solution 16 by puddling on the semiconductor substrate10. Then, nitrogen gas was supplied to the top of the semiconductorsubstrate 10 so as to form a flow of nitrogen gas such that it contactsthe surface of the developing solution 16. The flow rate of the nitrogengas was adjusted to 150 to 400 mm/sec on the surface of the developingsolution film 16 and at the same time, other adjustment was made for thedeveloping solution 16 not to flow out of and to a rear face of thesemiconductor substrate 10. Further, the gas supply portion 18 wasdisposed as shown in FIG. 5D and the flow rate of nitrogen gas was setto be quicker on the outer circle range than the inner circle range.Further, when supplying nitrogen gas, the semiconductor substrate 10 wasrotated and the rotation direction was made to coincide with thedirection of gas flow. At this time, the rotation speed of thesemiconductor substrate 10 was 5 rpm and the surface rotation speed ofthe developing solution 16 was 35 rpm. That is, the surface rotationspeed (relative rotation speed) of the developing solution film 16relative to the rotation speed of the semiconductor substrate 10 was 30rpm.

[0091] Here, I-beam resist film was formed on another semiconductorsubstrate and exposed irregularly. Then, the aforementioned relativerotation speed was reproduced and a flow of solution was observed. As aresult of observation, it was recognized that the solution moved on thesurface of the semiconductor substrate 10 at 100 μm/sec. If thesemiconductor substrate was rotated intermittently at 25 rpm like incase of the prior art, the moving speed of the solution was 5 μm/sec, sothat it was recognized that little flow of the solution occurred on thesurface of the semiconductor substrate 10.

[0092] Subsequently, after developing for 40 seconds, ozone of 20 ppm isadded to nitrogen gas supplied from the gas supply portion 15 after 40seconds pass after development is started. By this addition of ozone,solution product generated by development is fragmented. Then, after 20seconds pass after ozone is added, the supply of nitrogen gas to whichozone is added is stopped and the rotation speed of the semiconductorsubstrate 10 is increased up to 500 rpm. Then, pure water is poured overthe semiconductor substrate 10 and the rising process is performed.After rinsing, the supply of pure water was stopped and thesemiconductor substrate 10 was rotated at a high speed to blow purewater out of the surface of the semiconductor substrate 10 and dry thesurface.

[0093] Finally, after stopping the rotation of the semiconductorsubstrate 10, the semiconductor substrate 10 was carried using atransportation robot and then chemical liquid processing was finished.

[0094] The distribution (3 σ value) of resist pattern dimension in thesemiconductor substrate plane with this chemical liquid processing was4.5 nm with an isolation of 130 nm. As compared to 10 nm, which wasobserved when no air flow was formed, processing uniformity was improvedtremendously. Further, the number of the defects is reduced to one tenthof the conventional method.

[0095] In the above mentioned experiment, although the concentration ofozone to be added to nitrogen gas is 20 ppm, the present invention isnot restricted to this example, but any concentration is permissible aslong as it does not generate a large dimensional change or configurationerror in processing object film (resist film). The gas to be added maybe oxygen, hydrogen or the like as well as ozone.

[0096] ˜Liquid Removing (Cleaning/Drying) Process˜

[0097] Next, the liquid removing (cleaning/drying) process according tothe embodiment of the present invention is described.

[0098] First, the structure of the substrate drying apparatus accordingto the embodiment of the present invention will be described withreference to FIG. 14.

[0099] As shown in FIG. 14, the substrate drying apparatus of theembodiment of the present invention comprises: a substrate holdingportion 102 for holding a processing object substrate 101 on its topface; a plate 103 disposed above the substrate holding portion 102 andmade of a flat circular plate of 320 mm in diameter including an airintake hole 12 a of 32 mm in diameter in the center thereof; and an airflow control wall 104 provided so as to surround the substrate holdingportion 102 for preventing the substrate holding portion 102 fromsucking air. Further, according to this embodiment, the substrateholding portion 102, the plate 103 and the air flow control wall 104 arecovered with an outer cover 105.

[0100] A side face of the substrate holding portion 102 has aninvertedly-inclined gradient. A top face of the air flow control wall104 has a gradient substantially parallel to the gradient of the sideface of the substrate holding portion 102. By the rotation of the plate103, a negative pressure is generated at the space between theprocessing object substrate 101 and the plate 103. Then, the air flowwhich go toward the surface of the substrate from the surroundingatmosphere of the substrate holding portion 102, is generated. Theliquid, which is removed from the processing object substrate 101 anddiffused in the surrounding atmosphere by the air flow, and dust issucked and stick to the substrate again. By forming theinvertedly-inclined gradient on the side face of the substrate holdingportion 102 and providing the air flow control wall 104 surrounding thesubstrate holding portion 102, the air flow, which goes from the lowerpart of the substrate holding portion 102 to the above of the substrateholding portion 102, is generated. This air flow kills the air flowwhich returns from the side wall of the substrate holding portion 102 tothe process object substrate and can form the distribution of the airflow which goes from the center of the plate 103 to the outside. of theplate 103. Then, the effect of the liquid removing can be enhanced bythe air flow which goes from the air intake hole 103 a to the outerperiphery and, at the same time, it can prevent the influence of theliquid drop or the dust re-adhering.

Fourth Embodiment

[0101] Next, chemical liquid processing method according to the fourthembodiment of the present invention using the aforementioned substratedrying processing apparatus is described.

[0102] Reflection preventing film and chemically-amplifying resist wereapplied to the processing object substrate 101 and its surface wasexposed to reduced-size projection of a desired pattern through anexposure mask using KrF excimer laser having a wavelength of 248 nm.After heat treatment (PEB) of the substrate was carried out, tetramethylammonium hydroxide solution (TMAH; pH13.4) was poured to a processingobject substrate in a static condition using a scan nozzle (same as thechemical spouting nozzle 14 which scans the processing object substrate10 from an end of the processing object substrate 10 to the other endthereof while supplying the chemical liquid 16) and static developingwas carried out for 60 seconds.

[0103] Next, pure water was poured as cleaning chemical solution from anozzle provided at the center of the air intake hole 103 a in the plate103 to the substrate so as to wash solution product generated bydeveloping solution and development. When this cleaning was finished,pure water was swollen in 1 mm to 4 mm high from the processing objectsubstrate.

[0104] In a conventional drying step, the processing object substratewas rotated at high speeds to blow chemical liquid off the processingobject substrate by a centrifugal force to dry the processing objectsubstrate. However, according to fourth embodiment of the presentinvention, the rear face of the substrate was fixed to the substrateholding portion 101 and made static by means of a vacuum chuck and, justafter the processing object substrate is washed, the plate 103 made ofaluminum having the air intake hole 103 a in the center is brought up toa distance (about 4 mm jus the above the substrate) which enables liquidswollen from the processing object substrate 101 and the plate 103 tokeep a non-contact as shown in FIG. 15A. Then, as shown in FIG. 15B, theplate 103 was accelerated up to 10,000 rpm in about five seconds androtated normally at 10,000 rpm for about 10 seconds. After that, adistance between the plate 103 and the processing object substrate 101was reduced up to 1 mm, which is a minimum distance enabling remainingwater droplet and the plate to keep non-contact with each other. Next,the plate was rotated normally at 10,000 rpm for 10 seconds. After thenormal rotation was finished, the plate 103 was left from the processingobject substrate 101 and then, the drying step was finished (FIG. 15C).

[0105] By the above described step, liquid film on the processing objectsubstrate 101 was removed completely, so that the processing objectsubstrate 101 was dried. Further, as compared to the conventional dryingmethod by rotating the substrate at high speeds, fall of resist patterncould be reduced by 20 to 30%. Further, by fixing the processing objectsubstrate 101 by means of a vacuum chuck, generation of dust from therear face due to abrasion between the substrate and the chuck, which hadoccurred before, could be prevented.

[0106] In the above described liquid removing step, liquid on theprocessing object substrate was removed using following three operationsand effects of the present invention.

[0107] (1) By rotating the plate 103 at high speeds, gas existingbetween the processing object substrate 101 and the plate 103 flowed outalong the plate 103 at the initial phase of rotation as shown in FIG.16. The amount of air flowing out along the plate 103 becomes largerthan the amount of air sucked through the air intake hole 103 a in thecenter of the plate 103, so that a negative pressure is generatedbetween, the processing object substrate 101 and the plate 103. Thiseffect is considerable at the initial phase of rotation.

[0108] (2) Because of the aforementioned (1), as shown in FIG. 17,liquid swollen from the processing object substrate is sucked toward theplate 103 disposed above and after that, the liquid is blown off in adirection of tangent line of this rotation along the plate 103. Thiseffect was used mainly when the distance between the substrate and theplate was 4 mm. At this time, although a slight amount of dropletsremained on particularly fine resist pattern on the substrate, the otherliquid was removed.

[0109] (3) If accelerated rotation was changed to normal rotation, asshown in FIG. 18, a sufficient amount of air was sucked through the airintake hole 103 a in the center of the plate 103. As a result, with anegative pressure maintained between the processing object substrate 101and the plate 103, atmospheric pressure was not changed so much. Becauseof a strong air flow from the center of the processing object substrate101 to outside, (1) droplets were blown off the substrate and (2)evaporation was accelerated. Mainly this effect was used when thedistance between the processing object substrate 101 and the plate 103was 1 mm. As a result, a slight amount of droplets left on theprocessing object substrate 101 was removed completely, so that theprocessing object substrate was dried completely.

[0110] Preferably, the negative pressure is controlled depending on theamount of liquid on the processing object substrate 101. The control ofthe negative pressure is enabled by changing at least one of a rotationspeed or acceleration of the plate 103 and the distance between theprocessing object substrate 101 and the plate 103. Further, the controlof the negative pressure is also enabled by changing the diameter of anopening of the air intake hole 12 a in the center of the plate 103during a rotation of the plate 103.

[0111] Although various causes for fall of resist pattern can beconsidered, a main cause for pattern fall in cleaning/drying step isconsidered to be interfacial tension of cleaning chemical liquid (purewater, etc.) and adhesion between resist and cleaning chemical liquidthrough interface between them.

[0112] A fall of resist pattern according to the conventional dryingmethod will be described with reference to FIG. 19.

[0113] Usually, cleaning liquid between fine patterns of resist adheresup to a higher position than actual water level due to capillary vesselphenomenon by surface tension. According to drying method by high-speedrotation of the substrate in the conventional step, water level ofcleaning liquid between resist patterns is decreased by blow-out by arotation of the processing object substrate 101, so that a force bysurface tension is applied to chemical liquid inside two resist patterns(FIG. 19A). This force is transmitted to resist pattern through aninteraction between chemical liquid and resist pattern through aninterface between them. Thus, pattern fall occurs (FIG. 19B).

[0114] According to the conventional liquid removal method, if thesubstrate was rotated at high speeds, particularly in a fine processingpattern having a high aspect ratio, (1) a centrifugal force is appliedto the resist pattern and (2) a centrifugal force applied to liquid onthe substrate is felt through interfacial mutual reaction between liquidand resist pattern, so that the resist pattern is likely to fall down.

[0115] On the other hand, according to this embodiment, the processingobject substrate 101 was stopped and by rotating the plate 13 above thesubstrate 101, a pressure on the substrate 101 was turned negative, sothat chemical liquid between fine resist patterns was pulled up as shownin FIG. 20. Consequently, liquid was blown out along the plate 103 so asto remove liquid film on the processing object substrate 101.

[0116] Thus, a component in the direction of pattern fall of adheringforce of liquid interface to the resist pattern is decreased. Further,because the processing object substrate 101 is not rotated but static,no centrifugal force is applied to the substrate and liquid film on thesubstrate, fall of the resist pattern due to the centrifugal force canbe prevented.

[0117] Although, according to this embodiment, a flat circular plate(ø320) having an air intake hole (ø32) in the center thereof was used,the dimension of the air intake hole and the shape of the plate are notrestricted to particular ones as long as the same operation is ensured.To form a pressure condition and air flow capable of removing liquidfilm completely, the rotation speed of the plate needs to be 4000 rpm ormore and the distance between the substrate and the plate needs to beless than 10 mm. When the plate is rotated, there must be a gap betweenthe plate and liquid. Further, plate rotation time is not restricted toa value of this experiment. Further, although in the aforementionedexperiment, the chemically-amplifying resist for KrF excimer laser wasused and pure water was used as chemical liquid, the present inventionis not restricted to any particular resist type or chemical liquid type.

Fifth Embodiment

[0118] Next, chemical liquid processing method according to the fifthembodiment of the present invention using the aforementioned substratedrying processing apparatus is described.

[0119] Reflection preventing film and chemically-amplifying resist wereapplied to the processing object substrate 101 and its surface wasexposed to reduced-size projection of a desired pattern through anexposure mask using KrF excimer laser having a wavelength of 248 nm.After heat treatment (PEB) of the substrate was carried out, tetramethylammonium hydroxide solution (TMAH; pH13.4) was poured to a processingobject substrate in a static condition using a scan nozzle and staticdeveloping was carried out for 60 seconds.

[0120] Next, pure water was poured as cleaning chemical solution from anozzle provided in the center of the air intake hole 103 a in the plate103 to the substrate so as to wash solution product generated bydeveloping solution and development. When this cleaning was finished,pure water was swollen in 1 mm to 4 mm high from the processing objectsubstrate.

[0121] In this embodiment, the rear face of the substrate was fixed andmade static, the plate was kept static and just after cleaning, thedistance between liquid swollen from the substrate and plate was reducedto 1 mm, so that the plate 12 was brought into contact with the liquidfilm on the plate, thereby removing air layer between the substrate andthe plate completely (FIG. 21). Next, the plate was accelerated up to10,000 rpm in about five seconds and after that, the plate was rotatednormally at 10,000 rpm for about 10 seconds.

[0122] Through the above described process, liquid on the substrate wasblown out so that liquid film was removed completely. Consequently, thesubstrate was dried. Further, as compared,to the conventional dryingmethod by rotating the substrate at high speeds, fall of the resistpattern could be reduced by 20 to 30%. Further, like the aforementionedembodiment, by fixing the substrate by means of a vacuum chuck so thatit is static, generation of dust from the rear face due to abrasionbetween the substrate and chuck could be prevented.

[0123] After bringing the plate into contact with liquid, it ispreferable to press the plate against liquid in order to eliminate airlayer between the processing object substrate and plate.

[0124] In the liquid removing step of this embodiment, the liquid on thesubstrate was removed using following three operations and effects.

[0125] (1) In the initial phase of the rotation of the plate, air intakeis not carried out through the air intake hole in the center of theplate because a gap between the plates is filled with liquid. Thus, agap between the substrate and the plate becomes a considerably negativepressure.

[0126] (2) Because of the aforementioned (1), liquid swollen from thesubstrate is sucked toward the plate disposed above. After that, theliquid is blown off in the direction of tangent line along the plate.Because the plate is in direct contact with the top of the substrate inthis embodiment, this effect is larger than the fourth embodiment, sothat the liquid film can be removed effectively.

[0127] (3) If the rotation speed turns from acceleration to normalrotation, a sufficient amount of air is sucked through the air intakehole in the center of the plate. Because a negative pressure is keptbetween the substrate and the plate, atmospheric pressure is not changedso much. (1) Water droplets are blown out of the substrate and (2)evaporation was accelerated by a strong air flow from the center tooutside. Consequently, the liquid film on the substrate is removedcompletely so that the substrate is dried.

[0128] At this time, liquid between the resist patterns is sucked upwardas shown in the FIG. 20 like the aforementioned embodiment, so that thecomponent acting in the direction of fall is reduced. Further, aninfluence of the centrifugal force can be eliminated because thesubstrate is kept static. Because the plate is brought into contact withliquid film in this experiment, the effect of sucking pure water in theaforementioned (2) upward is strong, so that liquid film on thesubstrate can be removed mostly in the initial phase of acceleratedrotation.

[0129] Particularly, by carrying out hydrophilic treatment upon thesurface of the plate or processing the surface to porous state capableof inducing capillary phenomenon, the effect of sucking the liquid filmon the substrate upward between the plate and the liquid film isimproved, thereby reducing the component of a force acting for patternfall. Thus, the pattern fall can be reduced.

[0130] Further, by carrying out water repellent treatment upon thesurface of the plate, the repulsive force directs toward the outward ofthe substrate acts on the liquid and the liquid removing step can beperformed effectively.

[0131] Although, according to this embodiment, a flat circular plate(ø320) having an air intake hole (ø30) in the center thereof was used,the dimension of the air intake hole and the shape of the plate are notrestricted to particular ones as long as the same operation is ensured.The rotation time is not restricted to an experimental value. Therotation speed of the plate needs to be 4000 rpm or more and thedistance between the substrate and the plate needs to be within adistance in which the plate can contact liquid.

[0132] Although, in the aforementioned experiment, thechemically-amplifying resist for KrF excimer laser was used and purewater was used as chemical liquid, the present invention is notrestricted to any particular resist type or chemical liquid type.

Sixth Embodiment

[0133] Finally, the chemical processing method according to the sixthembodiment of the present invention, which is the successive process ofthe chemical liquid film forming/agitating step and liquid removing stepusing the plate, is described.

[0134] In this sixth embodiment of the present invention, an air flow isformed using a plate disposed above the chemical liquid 16 as same asthe aforementioned second embodiment of the present invention, and theliquid on the substrate is removed by the plate disposed above like theaforementioned fourth embodiment of the present invention. The sixthembodiment of the present invention is described below with reference toFIG. 1, FIG. 9˜FIG. 10 and FIG. 15.

[0135] (1) As shown in FIG. 9A, the processing object substrate 10 whichpreparing step is finished is carried to the top of the substrateholding portion 12 by means of a transportation robot (not shown). Then,the processing object substrate 10 is left from the transportation robotand received by the substrate holding portion 12. The processing objectsubstrate 10 is fixed to the substrate holding portion 12 by sucking(S101).

[0136] (2) Next, as shown in FIG. 9B, chemical liquid 16 for processinga processing object film on the processing object substrate 10 is formedon the processing object substrate 10. Chemical liquid is supplied from,for example, the chemical spouting nozzle 14 disposed above theprocessing object substrate 10. The chemical spouting nozzle 14 scansthe processing object substrate 10 from an end of the processing objectsubstrate 10 to the other end thereof while supplying the chemicalliquid 16. Consequently, the chemical liquid film 16 is formed on theprocessing object substrate 10 (S102).

[0137] (3) Next, as shown in FIG. 10A, air flow is formed above the filmof the chemical liquid 16 on the processing object substrate 10 byrotating a circular plate 28 disposed above the processing objectsubstrate 10. The circular plate 28 is a larger disc than the processingobject substrate 10 and disposed near the processing object substrate 10such that it is not in contact with the surface of the film of thechemical liquid 16. The central portion of the circular plate 28 ishollow and this section can be opened or closed by a valve (not shown).Here, the processing object substrate 10 is not rotated and is keptstill (In the figure, the substrate is rotated) (S103).

[0138] (4). Next, as shown in FIG. 10B, rinse liquid (e.g., pure water)22 is supplied from the rinse liquid supply port 20 disposed above theprocessing object substrate 10 and the processing object substrate 10 iscleaned while rotating it (S104).

[0139] (5) Finally, as shown in FIG. 15, the circular plate 28(103)disposed above the processing object substrate 10(101) is rotated inhigh speed with the processing object substrate 10(101) kept still. Withthis procedure, rinse liquid 22 is blown out from the processing objectplate 10(101) and the processing object substrate 10(101) is dried(S105).

[0140] As shown in FIG. 14, the apparatus according to the embodiment ofthe present invention comprises: a substrate holding portion 101 forholding a processing object substrate 102 on its top face; a plate 103disposed above the substrate holding portion 102 and made of a flatcircular plate of 320 mm in diameter including an air intake hole 12 aof 32 mm in diameter in the center thereof; and an air flow control wall104 provided so as to surround the substrate holding portion 102 forpreventing the substrate holding portion 102 from sucking air. Further,according to this embodiment, the substrate holding portion 102, theplate 103 and the air flow control wall 104 are covered with an outercover 105.

[0141] A side face of the substrate holding portion 102 has aninvertedly-inclined gradient. A top face of the air flow control wall104 has a gradient substantially parallel to the gradient of the sideface of the substrate holding portion 102. With this structure, theeffect of liquid removal process can be enhanced, and, at the same time,it can avoid the liquid droplets and the dust attach to the substrateagain.

[0142] Next, the chemical liquid processing method according to thesixth embodiment of the present invention is explained with the resultof the experiment performed by the inventors.

[0143] First, reflection preventing film of 6 nm and resist film of 400nm were formed successively on a semiconductor substrate 10, which wasthe processing object substrate. Then, after a latent, image was formedon a resist film using an exposure device, baking was carried out at130° for 60 seconds.

[0144] Next, developing solution 16, which was the chemical liquid, wassupplied to the top of a semiconductor substrate 10 so as to form filmof the developing solution 16 by puddling on the semiconductorsubstrate. Then, the circular plate 28 is rotated near the processingobject substrate 10 such that it is not in contact with the surface ofthe film of the chemical liquid 16 (for example, about 15 mm). Then, therotation speed of the circular plate 28 was adjusted so that the surfacerotation speed of the chemical liquid film 16 on the processing objectsubstrate 10 is 40 rpm. Upon this adjustment, the valve of the circularplate 28 was opened. And, the semiconductor substrate 10 is rotated by10 rpm during the process. At this time, the rotation speed of thecircular plate 28 was 4,000 rpm.

[0145] Subsequently, after developing for 60 seconds, pure water waspoured over the semiconductor substrate 10 and the plate 28 is rotatedby 5000 rpm after the plate 28 is moved close to the surface of thesemiconductor substrate 10 by 20 mm. By this process, the rinsingprocess was finished. Upon this process, the valve of the circular plate28 was opened.

[0146] Next, the supply of pure water was stopped and the plate 28 isapproached to the rinse liquid poured on the semiconductor substrate 10such that it is not in contact with the surface of the rinse liquid (forexample, about 4 mm). Then, this plate 28 was accelerated up to 10,000rpm in about five seconds and rotated normally at 10,000 rpm for about10 seconds. After that, a distance between the plate 28 and thesemiconductor substrate 10 was reduced up to 1 mm, which is a minimumdistance enabling remaining water droplet and the plate to keepnon-contact with each other. Next, the plate 28 was rotated normally at10,000 rpm for 10 seconds. After the normal rotation was finished, theplate 28 was left from the semiconductor substrate 10 again (FIG. 15C)and the semiconductor substrate 10 was dried.

[0147] Finally, after the rotation of the semiconductor substrate 10 wasstopped, the semiconductor substrate 10 is moved by transportation robotand the chemical liquid processing is finished.

[0148] The distribution (3 σ value) of resist pattern dimension in thesemiconductor substrate plane with this chemical liquid processing was4.5 nm with an isolation of 130 nm. As compared to 10 nm, which wasobserved when no air flow was formed, processing uniformity was improvedtremendously the substrate was dried. Further, as compared to theconventional drying method by rotating the substrate at high speeds,fall of the resist pattern could be reduced by 20 to 30%. Furthermore,by fixing the substrate by means of a vacuum chuck so that it is static,generation of dust from the rear face due to abrasion between thesubstrate and chuck could be prevented.

[0149] In the sixth embodiment of the present invention, the circularplate 28 which form air flow over chemical liquid film 16 may be aring-like plate 30 as shown in FIG. 12. And also, it can be blade-likeplate 32 as shown in FIG. 13

[0150] In the above mentioned experiment, the relative rotation speed ofthe chemical liquid film 16 is not restricted to 40 rpm, but may vary ina range of 10 to 60 rpm. And also, the distance between the circularplate 28 and the semiconductor surface 10 is not restricted to 15 mm.The distance between each plate 28,30,32 and the surface of chemicalliquid film 16, and the rotation speed of each plate 28,30,32 can be setto any condition, if the predetermined surface rotation speed ofchemical liquid film 16 is obtained and chemical liquid film 16 do notflow out of and to a rear face of the semiconductor substrate 10. Morepreferably, it is desirable that the distance between each plate28,30,32 and chemical liquid film 16 is in the range of 10˜30 mm and therotation speed of each plate 28,30,32 is around 2000˜6000 rpm.

[0151] Further, to form the condition of the pressure and the air flowwhich can remove the liquid film completely, the rotation speed of theplate needs to be 4000 rpm or more and the distance between thesubstrate and the plate needs to be within a distance in which the platecan contact liquid. Further, the rotation time is not restricted to anexperimental value. And further, the chemically-amplifying resist forKrF excimer laser was used and pure water was used as chemical liquid,the present invention is not restricted to any particular resist type orchemical liquid type.

Other Embodiments

[0152] Although the invention achieved by the inventors has beendescribed through the above embodiments, it should not be understoodthat a description and drawings which are part of this disclosurerestrict the present invention. That is, various modified embodimentsthereof and operating technologies will be evident to those skilled inthe art from this disclosure.

[0153] For example, in the chemical liquid processing method accordingto the first, second and third embodiment of the present invention, itis preferable to reform the surface quality of the processing objectsubstrate 10 before the puddling formation of developing solution 16 onthe semiconductor substrate 10 by dropping pure water or diluteddeveloping solution onto the processing object substrate 10.Consequently, the surface of the processing object substrate 10 (resistfilm surface) is adapted to the developing solution 16, so that puddlingformation is facilitated.

[0154] Further, in the chemical liquid processing method according tothe second embodiment of the present invention, it is desirable to formair flow in de-carbonizing environment. Consequently, mixing of CO₂ intoair flow can be prevented.

[0155] As described above, it should be understood that the presentinvention includes various embodiments not described in thisspecification. Therefore, the present invention is limited by onlyspecific matters relating to claims of the invention, which areintroduced appropriately from the disclosure of the invention.

What is claimed is:
 1. A chemical liquid processing apparatus forprocessing a substrate using chemical liquid, comprising: a substrateholding portion for holding a substrate; a chemical liquid spoutingnozzle disposed on said substrate holding portion for supplying chemicalliquid onto a substrate held by said substrate holding portion so as toform chemical liquid film on the substrate; and a gas, supply portionfor forming air flow which contacts with the surface of said chemicalliquid film so as to form a flow of chemical liquid on the surface ofthe chemical liquid film.
 2. A chemical liquid processing apparatus forprocessing a substrate using chemical liquid, comprising: a substrateholding portion for holding a,substrate; a plate disposed above saidsubstrate holding portion and having an air intake hole going throughvertically; an air flow control wall installed so as to surround saidsubstrate holding portion and for preventing air around the substrateholding portion from being sucked; and a rotating mechanism for rotatingsaid plate, wherein the side face of said substrate holding portion hasan invertedly-inclined gradient, the top face of said air flow controlwall has a gradient substantially parallel to the gradient of the sideface of said substrate holding portion, and a negative pressure isgenerated between the plate and the substrate held by the substrateholding portion by a rotation of said plate, and air flow isgenerated-between said substrate and said plate by sucking air throughsaid air intake hole.
 3. A chemical liquid processing method forprocessing a substrate using chemical liquid, comprising the steps of:supplying chemical liquid for processing a processing object film to aprocessing object substrate on which said processing object film isformed so as to form chemical liquid film on said processing objectsubstrate; and after the step for forming the chemical liquid film,forming air flow such which contacts with the chemical liquid film so asto hold said chemical liquid film on said processing object substrateand form a flow of the chemical liquid on the surface of said chemicalliquid film.
 4. The chemical liquid processing method according to claim3, wherein the air flow is formed by supplying air flow formation gasfrom a gas supply portion disposed near an outer periphery of theprocessing object substrate to above the processing object substrate. 5.The chemical liquid processing method according to claim 4, wherein theair flow formation gas is inactive gas.
 6. The chemical liquidprocessing method according to claim 5, wherein the air flow formationgas contains any one of ozone, oxygen and hydrogen.
 7. The chemicalliquid processing method according to claim 3, wherein the air flow isformed by rotating a plate disposed above the processing objectsubstrate.
 8. The chemical liquid processing method according to claim7, wherein the shape of the plate is any one of circular, ring-like andblade-like.
 9. The chemical liquid processing method according to claim3, wherein the step for forming a flow of the chemical liquid is carriedout in decarbonized environment.
 10. The chemical liquid processingmethod according to claim 3, wherein in the step for forming a flow ofthe chemical liquid, the processing object substrate is rotated.
 11. Thechemical liquid processing method according to claim 10, wherein theprocessing object substrate is rotated continuously or intermittently.12. The chemical liquid processing method according to claim 11, whereinthe, processing object substrate is rotated in a forward directionrelative to the direction of the air flow.
 13. A chemical liquidprocessing method for removing liquid supplied to a substrate,comprising the steps of: holding said substrate on a horizontalsubstrate holding portion; rotating a plate having an air intake hole onsaid substrate; generating a negative pressure between the plate and aprocessing object substrate by rotating said plate; and generating airflow between said processing object substrate and said plate by suckingair through said air intake hole in the presence of the negativepressure.
 14. The chemical liquid processing method according to claim13, wherein in the step for generating the negative pressure, saidnegative pressure is controlled by changing at least one of a rotationspeed or acceleration of the plate and a distance between the substrateand the plate.
 15. The chemical liquid processing method according toclaim 14, wherein the negative pressure is controlled depending on theamount of the chemical liquid on the substrate.
 16. The chemical liquidprocessing method according to claim 13, wherein the diameter of anopening of the air intake hole in the center of the plate is changedduring a rotation of the plate.
 17. The chemical liquid processingmethod according to claim 13, wherein the step for rotating the plate iscarried out with a gap between the plate and liquid.
 18. The chemicalliquid processing method according to claim 13, wherein the step forrotating the plate further comprises the steps of: moving said platedownward from above the substrate so as to bring said plate into acontact with liquid on said substrate; and rotating said plate in acondition that liquid is in contact with said plate.
 19. The chemicalliquid processing method according to claim 18, wherein in the step forbringing the liquid into contact with the plate, said plate is pressedto said liquid so as to eliminate an air gap between the substrate andsaid plate.
 20. The chemical liquid processing method according to claim19, wherein a liquid contacting surface of the plate is subjected tohydrophilic treatment or processing to porous state indicating an effectof air suction due to capillary phenomenon.
 21. The chemical liquidprocessing method according to claim. 19, wherein a liquid contactingsurface of the plate is subjected to water repellent treatment.
 22. Thechemical liquid processing method according to claim 13, wherein airflow directed from out of the substrate to the center of the substrateis killed by generating air flow directed from below the substrateholding portion to outside above said substrate holding portion on anouter peripheral portion of the substrate.
 23. A chemical liquidprocessing method for processing a substrate using chemical liquid,comprising the steps of: supplying chemical, liquid for processing aprocessing object film to a processing object substrate on which saidprocessing object film is formed so as to form chemical liquid film onsaid processing object substrate; after the step for forming thechemical liquid film, forming air flow such which contacts with thechemical liquid film so as to hold said chemical liquid film on saidprocessing object substrate and form a flow of the chemical liquid onthe surface of said chemical liquid film using a plate disposed abovesaid processing object substrate and having an air intake hole with thevalve at the center; and removing said chemical liquid supplied to asubstrate, wherein the step for removing said chemical liquid suppliedto a substrate further comprises the steps of: generating a negativepressure between the plate and said processing object substrate byrotating said plate; and generating air flow between said processingobject substrate and said plate by sucking air through said air intakehole in the presence of the negative pressure.